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lab: RC Constant. Can any you guys write in pdf form only for the Application pa

ID: 1836574 • Letter: L

Question

lab: RC Constant.

Can any you guys write in pdf form only for the Application part for RC constant lab? Plsease help me I didn't get that the application part?

As example the format will be like thise.......but thise one is for capaciter sandwich.

Applications/Discussion:

The development of materials with higher dielectric constants is of great importance in our technologically driven society. The drive to create smaller, lighter, and more efficient tech products is aim of most modern tech producers. To date the capacitor is the second bulkiest item attached to a circuit [next to batteries], although it is integral to many circuit functions. To make a capacitor smaller it is advantageous to use materials with high dielectric constants. The closer the plates are to each other the stronger the field and the higher the capacitance for charge. The idea is to hold a charge difference without allowing the circuit to complete until it is intended. Lower values and/or thinner materials would allow a short circuit. In other words the idea behind a capacitor is to insulate a charge difference and [at least temporarily] maintain a field between the plates. It is interesting to note that density, polarity and crystalline structure affect the dielectric constants. A more dense material usually has a high constant. Less dense materials such as gases can have a high if they are highly polarized. Materials with highly organized crystalline structure tend to be more conductive and less insulative. Attached is an interesting online exercise from Cambridge demonstrating these principles: http://www.doitpoms.ac.uk/tlplib/dielectrics/structure.php.

Explanation / Answer

The delaying of a signal for a wire or other circuit, measured in form of a group delay or phase delay or as the effective propagation delay of a digital transition, is generally dominated by resistive-capacitive effects, depending on the distance and various other parameters.

Resistive-capacitive delay, or RC delay, dominated by the RC time constant hinders the further increase of the speed in microelectronic integrated circuits. When the size of the feature becomes extremely smaller and smaller to increase the clock speed, the RC delay plays an important role. This delay can generally be reduced by replacing the conducting wire of aluminum with copper, thus curbing and reducing the resistance; it can also be reduced by interchanging the interlayer dielectric (which is typically silicon dioxide) to low-dielectric-constant materials, which will inevitably reduce the capacitance.

A typical digital propagation delay of any resistive wire is approximately half of R times C; since both R and C are proportional to wire length, the delay scales as the square of the wire length. Charge is seen to spread by diffusion in such a wire, as already explained by Lord Kelvin in the mid 1800s.[2] Until Heaviside discovered that Maxwell's equations imply wave propagation when there is sufficient inductance in the circuit, the square diffusion relationship was thought to provide a fundamental limit to the improvement of long-distance telegraph cables. That old analysis was superseded in the telegraph domain, but remains relevant for long on-chip interconnects.