9. AuCu has this type of bonding A. Ionic B. Covalent C. Metallic 10. Which has
ID: 698110 • Letter: 9
Question
9. AuCu has this type of bonding A. Ionic B. Covalent C. Metallic 10. Which has a higher% ionic bonding and lower% covalent bonding? A. Na2O B. BeO C. Both have the same 11. Which property does not increase when the bond strength increases? A. B. C. D. Elastic Modulus (Stiffness) Thermal Expansion Melting Temperature None of the above (all increase when the bond strength increases) 12. Which of the following has the smallest interplanar spacing in a cubic material?? (c) (300) 1.3. Sljp ocurs in the direction of highest atom density (close packed direction). Which direcetion is a close packed direction? A. [111] for FCC B. [100] for FCC C. [110] for FCC 14. Which material has the lowest melting point? A. B. C. AI, E- 69 GPa Fe, E = 207 GPa W, E = 407 GPa 15. Which of these properties usually decrease with cold working a metal? a. Yield stress b. Hardness c. Ductility d. All of the above e. None of the above 16. On which of the following slip systems will slip NOT occur for a single FCC crystal, if the tensile direction is [100]? d. None of the above e. All of the aboveExplanation / Answer
Ans 9 B) covalent
Covalent bond is formed when there is no exchange of electrons but sharing of electrons take place between th constituent atoms.
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