For each of the materials in the table below, indicate the type of bonding prese

Question

For each of the materials in the table below, indicate the type of bonding present, the material class each belongs to, and whether the value would be "High", "Medium", or "Low" for each of the properties listed. Use a reference source (e.g., textbook, reliable internet source, etc.) to obtain typical values for each of the properties listed above. (Do they confirm your predictions?) Theoretically, values of elastic modulus, melting point, and thermal expansion coefficient should all be correlated (positively or negatively) with the bond strength in each solid. Explain whether your values of elastic modulus and melting point support this hypothesis. Also, use this information to predict the ranking of thermal expansion coefficients for these materials. Look up actual values to confirm your prediction.

Explanation / Answer

The following are the actual values of the properties of the materials:

bond type

Ionic As well as covalent

in nature thus it is amphoteric

1084.62oC or

1357.77K

130oC to 171oC

or

403oC to 4440C

The thermal expansion ranking of the given materials based on the melting point of each material will be as follows:

The metallic bonds supposed to the most ductile and strong bonds in nature thus the metal copper is having highest thermal expansion and polypropylene are the double bonds which are considered to be weakest in nature.

thank you;)

Material Al2O3 Copper polypropylene

bond type

Ionic As well as covalent

in nature thus it is amphoteric

metallic Polymer Elastic Modulus 69 to 665 MPa 110-128GPa 1300 to 1800 Pa Ductility 0.00018 0.62 12 Melting point 2072oC or 2369 K

1084.62oC or

1357.77K

130oC to 171oC

or

403oC to 4440C

Electrical Conductivity 16.9 S/m 585 X 106 S/m 10-14 ~ 10-16 S/m

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