15.3.5 The pull strength of a wire-bonded lead for an integrated circuit is moni

Question

15.3.5 The pull strength of a wire-bonded lead for an integrated circuit is monitored. The following table provides data for 20 samples each of size three Sample Number x1 x2x3 ][15.515.815.2 15.6 16.5 15.0 16.1 16.1 13.5 13.5 12.5 10.2 18.3 16.1 17.0 19.2 17.2 19.4 14.1 12.4 11.7 15.6 13.3 13.6 13.9 14.9 15.5 118.721.220.1 15.3 13.1 13.7 13.9 14.9 10 1216.6 18.0 18.0 137.0115.2(18.1 | | 14 |16.3 17.0 15.2 18.1 16.5 17.7 15 8.4 7.7 8.4 | 16 111.113.8 11.9 11.1 13.8 11.9 16.5 17.1 18.5 18.0 14.115.9 1917.8 17.3 12.0 18 20 11.5 10.8 11.2

Explanation / Answer

a)

here for sample size n=3 ; A2 =1.023

UCL =Xbar -A2*Rbar =17.38

CL =15.09

LCL =12.79

b)

for sample size n=3 ; D3 and D4 are 0 and 2.574

UCL =D4*Rbar =5.78

CL =2.25

LCL =0

b)

does the process appear to be in control =No

how many subgroups --8

Mean Range Sample 1 15.5 0.6 Sample 2 15.7 1.5 Sample 3 15.23333 2.6 Sample 4 12.06667 3.3 Sample 5 17.13333 2.2 Sample 6 18.6 2.2 Sample 7 12.73333 2.4 Sample 8 14.16667 2.3 Sample 9 14.76667 1.6 Sample 10 20 2.5 Sample 11 14.03333 2.2 Sample 12 17.53333 1.4 Sample 13 16.76667 2.9 Sample 14 16.83333 1.4 Sample 15 8.166667 0.7 Sample 16 12.26667 2.7 Sample 17 17.36667 2 Sample 18 16 3.9 Sample 19 15.7 5.8 Sample 20 11.16667 0.7 Average 15.08667 2.245

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