You are designing electronic components for use in an implantable medical device

Question

You are designing electronic components for use in an implantable medical device. Your electronic components are soldered on a board which is then put into a casing before implantation. You need to conduct a series of reliability tests of the soldered components before they can be qualified to be assembled. Your boss tells you that one of the tests that you do not need to do is testing the solder joints for creep, because the service temperature is low, i.e., 37oC, and the solder melts at I860C. Do you agree with your boss? Why or why not?

Explanation / Answer

i agree with boss statement With most tin/lead solder combinations, melting does not take place all at once. Fifty-fifty solder begins to melt at 183 C (361 F), but it's not fully melted until the temperature reaches 216 C (420 F). Between these two temperatures, the solder exists in a plastic or semi-liquid state. hard solders that contain silver have high melting temp. They are mostly used in Jewelry work. for electronic circuits you can carry out Computer simulations of solder joint reliability tests for creep etc

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