The substitutional diffusion of Ni (solute) in Cu (solvent) is a thermally activ

Question

The substitutional diffusion of Ni (solute) in Cu (solvent) is a thermally activated process (improves with temperature) increases in rate with increasing temperature requires the presence of vacancies all of the above Covalent bonds are always strong, so the material with covalent bonds has a very high melting temperature. Ionic bonding is unidirectional, which can only attract the ions from certain direction. Polymorphism means that the material has more than one crystal structure at different temperatures or in different situations. Isotropic materials have the measured properties which depend on the crystallographic directions. There are two types of point defects in materials: one is substitutional and the other is interstitial. The atomic packing factor can never be greater than 1.00. The atomic packing factor for Face-Centered Cubic and Hexagonal Close-Packed crystal systems are different, and FCC is more compact than HCP structure.

Explanation / Answer

7) d

8) covalent bonds weak compare to ionic bonds and MP also low

9) false

10) true

11)true

12) true

13) true

14) True

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