Which 3 of the following process techniques will enhance the number of die from
ID: 1064735 • Letter: W
Question
Which 3 of the following process techniques will enhance the number of die from each wafer ?
Improve filtration of gas and chemicals.
Work with vendors to increase the service interval for tools.
Use a larger-diameter wafer.
Automate transport within the fab using FOUPs.
Use thinner saw blades for singulation.
Optimize gate layout to give smaller die.
Improve filtration of gas and chemicals.
Work with vendors to increase the service interval for tools.
Use a larger-diameter wafer.
Automate transport within the fab using FOUPs.
Use thinner saw blades for singulation.
Optimize gate layout to give smaller die.
Explanation / Answer
Which 3 of the following process techniques will enhance the number of die from each wafer ?
Improve filtration of gas and chemicals.--------ANSWER
Work with vendors to increase the service interval for tools.
Use a larger-diameter wafer.
Automate transport within the fab using FOUPs.-----ANSWER
Use thinner saw blades for singulation.
Optimize gate layout to give smaller die.-----ANSWER
a FOUP administration framework, for dealing with a majority of different parcel FOUPs; a constant dispatch framework for controlling dispatching of wafer part arranges inside a wafer creation framework; a programmed material taking care of incorporation framework having a stocker for putting away and sequencing a majority of FOUPs, the stocker having an installed sorter arranged there inside for sorting wafers inside a majority of numerous parcel FOUPs, and a FOUP transportation framework for transporting FOUPs inside a wafer manufacture office; a make execution framework in agent correspondence with the continuous dispatch framework for controlling formula handling and for controlling stream of FOUPs inside the FAB; and a PC coordinated assembling framework for computerizing gear inside the AMHS. Furthermore gave is a technique to utilizing the inserted sorter to sort FOUPs and a majority of wafers inside the AMHS.
Improve filtration of gas and chemicals.--------ANSWER
Work with vendors to increase the service interval for tools.
Use a larger-diameter wafer.
Automate transport within the fab using FOUPs.-----ANSWER
Use thinner saw blades for singulation.
Optimize gate layout to give smaller die.-----ANSWER
a FOUP administration framework, for dealing with a majority of different parcel FOUPs; a constant dispatch framework for controlling dispatching of wafer part arranges inside a wafer creation framework; a programmed material taking care of incorporation framework having a stocker for putting away and sequencing a majority of FOUPs, the stocker having an installed sorter arranged there inside for sorting wafers inside a majority of numerous parcel FOUPs, and a FOUP transportation framework for transporting FOUPs inside a wafer manufacture office; a make execution framework in agent correspondence with the continuous dispatch framework for controlling formula handling and for controlling stream of FOUPs inside the FAB; and a PC coordinated assembling framework for computerizing gear inside the AMHS. Furthermore gave is a technique to utilizing the inserted sorter to sort FOUPs and a majority of wafers inside the AMHS.
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